Electroninks, the leading provider of Metal Organic Decomposition inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of its advanced conductive copper ink line. The new copper ink expands Electroninks' world-leading portfolio of metal complex inks, offering customers greater manufacturing flexibility and a lower total cost of ownership. Electroninks will showcase the new copper ink line at booth Q5152 in Hall 2 at SEMICON Taiwan from September 4-6, 2024.

A high demand application for the new copper ink is seed layer printing for fine line metallization and RDL formation in combination with the company's proprietary iSAP™ process. For this application, Electroninks' copper ink replaces industry-standard electroless copper plating (e-less) and physical vapor deposition (PVD) tie layers, while significantly increasing production throughput and greatly reducing the ESG footprint. Compared to the traditional processes (PVD and e-less), ink-based additive printing uses only a fraction of the water and energy, factory footprint and capital costs, offering customers the lowest total cost of ownership and highest ROI on the market.

The copper inks are applied by spray coating, screen printing, inkjet printing, spin-on and other conventional printing methods. Beyond the seed layer application, Electroninks works with customers on a variety of applications, including advanced packaging, for various markets. "These copper inks complement Electroninks' strong and diverse MOD ink product portfolio, providing customers with best-in-class ESG and cost savings," said Brett Walker, CEO and co-founder of Electroninks.

"The MOD inks Electroninks has offered to the market for several years offer unique properties that are well suited to today's semiconductor wafers and module-based packages that require high performance thermal and power management," said Jim Haley, Vice President of Marketing, IMAPS Executive Council. "The introduction of a copper-based MOD product is usually well received by markets and customers, as copper is a standard in electronics design for many use cases. While silver, gold and other MOD inks will continue to serve this market, we welcome MOD copper inks to meet important needs in the advanced packaging space."

Electroninks offers a range of copper inks to meet customer demand for adhesion to various substrates including glass, silicon and EMC. These inks are compatible with various printing techniques and can be cured in a short time at low temperatures - up to 140°C in 5 minutes under nitrogen or ambient conditions.

About Electroninks:

Electroninks Incorporated is a global leader in the commercialization of advanced materials for electronics and semiconductor packaging. We have developed a full range of proprietary conductive metal complex ink solutions and complementary material sets, accelerating time to market for both new innovations and breakthrough manufacturing solutions.

Electroninks' metal complex inks - including silver, gold, platinum, nickel and copper - offer higher conductivity, manufacturing flexibility and cost efficiency. The company's conductive inks provide reliable solutions for applications in printed circuit board (PCB) manufacturing, semiconductor packaging, consumer electronics, wearables, medical devices and more. In addition, we work closely with the best equipment and integration partners to provide our customers with a comprehensive ink and process solution and ultimately reduce costs and complexity in manufacturing.

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Contact:
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Nicolia Wiles
PRIME|PR
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nwiles@prime-techpr.com

Contact@Electroninks.com
512-766-7555

 

Source: businesswire.com

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