DuPont will showcase its novel process solutions for component finishing at SUR/FIN 2023, a conference and trade show dedicated specifically to the surface technology industry. The show will be held from June 6-8, 2023. The Interconnect Solutions (ICS) business, part of DuPont Electronics & Industrial, will exhibit its novel technologies and products in Booth #455, at the Huntington Convention Center of Cleveland, OH.

"We offer a broad range of green chemistry to advance the UN (United Nations) Sustainable Development Goals (SDGs) and create value for our customers," said Gregory Mitchell, Segment Leader of Electronic & Industrial Finishing, DuPont ICS. "Satisfying the diverse and challenging technology requirements must be delivered in a sustainable way. DuPont continues to invest to deliver simpler, faster and more sustainable processes."

The major global markets that utilize component finishing processes are in a period of exciting change, where substitution of mature process technology is driving innovation and opportunity, as well as the demand for improved performance, and elimination of toxic substances.

DuPont ICS has responded to these dynamics and will showcase novel products during SUR/FIN 2023, designed to satisfy reliability, productivity and sustainability requirements. These include:

• Nikal™ BF-100, a high-performance boric acid-free* nickel electrolyte that produces corrosion resistance improvement, with high throw, higher CD range and reduced deposit stress.
• Silveron™ GT-210, a cyanide-free* silver electrolyte producing deposits exhibiting very low friction and wear characteristics, suited to high power connectors requiring stable low contact resistance connections, as demanded in applications such as EV charging.
• Solderon™ ST-400 high speed matte tin, providing 40% higher plating speed, simplified packaging and analysis, with superior electrolyte stability and deposit performance.

*Component not known to be present

 

Source:prnewswire.com

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