JST Manufacturing Inc

JST Manufacturing Inc

4040 E Lanark St, Meridian, ID 83642, United States

Single Wafer Wet Processing

Single Wafer Wet Processing

JST’s single wafer wet process system utilizes an automated chemical spray process on a single wafer. The system includes programmable oscillating spray nozzles, wafer speed (RPM), and precision adjustment of the distance between the nozzles and the surface of the wafer. Automated dispense from the chemical storage reservoir provides repeatable control of volume and mixing. The spin chucks are designed for either DIW backside rinsing or backside isolation. This system is offered with either auto or manual wafer loading/unloading configurations. As with all JST wet benches, they are designed for ease of maintenance activities and come with our standard 24/7 Technical Support.

Single Wafer Wet Processing - Standard Features

Up to 300mm product size capable

Material Options: 304L Stainless Steel, 316L Stainless Steel, FM Approved PVC-C, or White Polypropylene with PTFE spray bowl

Internal Stainless Steel frames isolated from process chemistry

Automated or Manual wafer loading

Wafer rotation speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm

Active gripping or passive spin chuck available

DIW backside rinse or backside isolation

Programmable servo controlled Oscillating Spray Nozzles

Programmable chemical flow rate and pressure control

Precision distance control between nozzles & wafer

Single pass or chemical recirculation available

Designed with a programmable logic controller (PLC) in addition to an industrial PC that control the entire wet bench

Local data logging of all process parameters and lot tracking stored on the PC’s hard drive

Ergonomically mounted 23” Color Touchscreen Monitor, with JST GENII Software

Ergonomically designed front load/unload access for product cassettes


Optional Features

Multiple spray chambers available for increase throughput

Rear access maintenance area provides dual containment for reservoirs, pumps, filters, and plumbing

GEM/SECSII Factory Automation Interface

CO2 Fire Suppression System

Nitrogen and DI Water Hand Spray Guns

On-board chemical analyzer with integrated concentration control and monitoring for reduced chemical usage

SEMI S2 Certification

CE Marking

3rd Party Electrical Inspections


Applications for Single Wafer Wet Process System

SC1 Clean

SC2 Clean

Nitride Etch

Pre-Gate Clean

Pre-Metal Clean

Photoresist Strip, Post Ash Clean, Post Implant Resist Strip, Post Etch Resist Strip (Optional SC1)

Metal Lift Off

KOH Etching

TMAH Etching

Aqua Regia Etching

Silicon Wafer Etching

Lab or fab material cleaning

HF, DHF, BOE Oxide Etching

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