Single Wafer Wet Processing
JST’s single wafer wet process system utilizes an automated chemical spray process on a single wafer. The system includes programmable oscillating spray nozzles, wafer speed (RPM), and precision adjustment of the distance between the nozzles and the surface of the wafer. Automated dispense from the chemical storage reservoir provides repeatable control of volume and mixing. The spin chucks are designed for either DIW backside rinsing or backside isolation. This system is offered with either auto or manual wafer loading/unloading configurations. As with all JST wet benches, they are designed for ease of maintenance activities and come with our standard 24/7 Technical Support.
Single Wafer Wet Processing - Standard Features
Up to 300mm product size capable
Material Options: 304L Stainless Steel, 316L Stainless Steel, FM Approved PVC-C, or White Polypropylene with PTFE spray bowl
Internal Stainless Steel frames isolated from process chemistry
Automated or Manual wafer loading
Wafer rotation speed control from 1 rpm to 6,000 rpm with a repeatability of .2 rpm
Active gripping or passive spin chuck available
DIW backside rinse or backside isolation
Programmable servo controlled Oscillating Spray Nozzles
Programmable chemical flow rate and pressure control
Precision distance control between nozzles & wafer
Single pass or chemical recirculation available
Designed with a programmable logic controller (PLC) in addition to an industrial PC that control the entire wet bench
Local data logging of all process parameters and lot tracking stored on the PC’s hard drive
Ergonomically mounted 23” Color Touchscreen Monitor, with JST GENII Software
Ergonomically designed front load/unload access for product cassettes
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Optional Features
Multiple spray chambers available for increase throughput
Rear access maintenance area provides dual containment for reservoirs, pumps, filters, and plumbing
GEM/SECSII Factory Automation Interface
CO2 Fire Suppression System
Nitrogen and DI Water Hand Spray Guns
On-board chemical analyzer with integrated concentration control and monitoring for reduced chemical usage
SEMI S2 Certification
CE Marking
3rd Party Electrical Inspections
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Applications for Single Wafer Wet Process System
SC1 Clean
SC2 Clean
Nitride Etch
Pre-Gate Clean
Pre-Metal Clean
Photoresist Strip, Post Ash Clean, Post Implant Resist Strip, Post Etch Resist Strip (Optional SC1)
Metal Lift Off
KOH Etching
TMAH Etching
Aqua Regia Etching
Silicon Wafer Etching
Lab or fab material cleaning
HF, DHF, BOE Oxide Etching
